Browsing by Subject "Aspect Ratio"
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The Bosch process is a type of deep reactive-ion etching (DRIE) of silicon. It is a type of plasma etching, or dry etching, that uses physical and chemical processes to etch the surface of a silicon sample. Due to its ...
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Simulation of Three-Dimensional Laminar Flow and Heat Transfer in an Array of Parallel Microchannels (2009-05-15)Heat transfer and fluid flow are studied numerically for a repeating microchannel array with water as the circulating fluid. Generalized transport equations are discretized and solved in three dimensions for velocities, ...